MAPS: Multi-Fidelity AI-Augmented Photonic Simulation and Inverse Design Infrastructure

Inverse design has emerged as a transformative approach for photonic device optimization, enabling the exploration of high-dimensional, non-intuitive design spaces to create ultra-compact devices and advance photonic integrated circuits (PICs) in computing and interconnects. However, practical challenges, such as suboptimal device performance, limited manufacturability, high sensitivity to variations, computational inefficiency, and lack of interpretability, have hindered its adoption in commercial hardware. Recent advancements in AI-assisted photonic simulation and design offer transformative potential, accelerating simulations and design generation by orders of magnitude over traditional numerical methods. Despite these breakthroughs, the lack of an open-source, standardized infrastructure and evaluation benchmark limits accessibility and cross-disciplinary collaboration. To address this, we introduce MAPS, a multi-fidelity AI-augmented photonic simulation and inverse design infrastructure designed to bridge this gap. MAPS features three synergistic components: (1) MAPS-Data: A dataset acquisition framework for generating multi-fidelity, richly labeled devices, providing high-quality data for AI-for-optics research. (2) MAPS-Train: A flexible AI-for-photonics training framework offering a hierarchical data loading pipeline, customizable model construction, support for data- and physics-driven losses, and comprehensive evaluations. (3) MAPS-InvDes: An advanced adjoint inverse design toolkit that abstracts complex physics but exposes flexible optimization steps, integrates pre-trained AI models, and incorporates fabrication variation models. This infrastructure MAPS provides a unified, open-source platform for developing, benchmarking, and advancing AI-assisted photonic design workflows, accelerating innovation in photonic hardware optimization and scientific machine learning.

SUPERMERGE: An Approach For Gradient-Based Model Merging

Large language models, such as ChatGPT, Claude, or LLaMA, are gigantic, monolithic, and possess the superpower to simultaneously support thousands of tasks. However, high-throughput applications often prefer smaller task-specific models because of their lower latency and cost. One challenge of using task-specific models is the incremental need for solving newer tasks after the model is already deployed for existing tasks. A straightforward solution requires fine-tuning the model again for both existing and new tasks, which is computationally expensive and time-consuming. To address this issue, we propose a model merging based approach called SUPERMERGE. SUPERMERGE is a gradient-based method to systematically merge several fine-tuned models trained on existing and new tasks. SUPERMERGE is designed to be lightweight and fast, and the merged model achieves similar performance to fully fine-tuned models on all tasks. Furthermore, we proposed a hierarchical model merging strategy to reduce the peak space requirement without sacrificing the performance of the merged model. We experimentally demonstrate that SUPERMERGE outperforms existing model merging methods on common natural language processing and computer vision tasks.

GPU-Accelerated Inverse Lithography Towards High Quality Curvy Mask Generation

Inverse Lithography Technology (ILT) has emerged as a promising solution for photo mask design and optimization. Relying on multi-beam mask writers, ILT enables the creation of free-form curvilinear mask shapes that enhance printed wafer image quality and process window. However, a major challenge in implementing curvilinear ILT for large-scale production is mask rule checking, an area currently under development by foundries and EDA vendors. Although recent research has incorporated mask complexity into the optimization process, much of it focuses on reducing e-beam shots, which does not align with the goals of curvilinear ILT. In this paper, we introduce a GPU-accelerated ILT algorithm that improves not only contour quality and process window but also the precision of curvilinear mask shapes. Our experiments on open benchmarks demonstrate a significant advantage of our algorithm over leading academic ILT engines.

Intelligent OPC Engineer Assistant for Semiconductor Manufacturing

Advancements in chip design and manufacturing have enabled the processing of complex tasks such as deep learning and natural language processing, paving the way for the development of artificial general intelligence (AGI). AI, on the other hand, can be leveraged to innovate and streamline semiconductor technology from planning and implementation to manufacturing. In this paper, we present \textit{Intelligent OPC Engineer Assistant}, an AI/LLM-powered methodology designed to solve the core manufacturing-aware optimization problem known as optical proximity correction (OPC). The methodology involves a reinforcement learning-based OPC recipe search and a customized multi-modal agent system for recipe summarization. Experiments demonstrate that our methodology can efficiently build OPC recipes on various chip designs with specially handled design topologies, a task that typically requires the full-time effort of OPC engineers with years of experience.

Differentiable Edge-based OPC

Optical proximity correction (OPC) is crucial for pushing the boundaries of semiconductor manufacturing and enabling the continued scaling of integrated circuits. While pixel-based OPC, termed as inverse lithography technology (ILT), has gained research interest due to its flexibility and precision. Its complexity and intricate features can lead to challenges in mask writing, increased defects, and higher costs, hence hindering widespread industrial adoption. In this paper, we propose DiffOPC, a differentiable OPC framework that enjoys the virtue of both edge-based OPC and ILT. By employing a mask rule-aware gradient-based optimization approach, DiffOPC efficiently guides mask edge segment movement during mask optimization, minimizing wafer error by propagating true gradients from the cost function back to the mask edges. Our approach achieves lower edge placement error while reducing manufacturing cost by half compared to state-of-the-art OPC techniques, bridging the gap between the high accuracy of pixel-based OPC and the practicality required for industrial adoption, thus offering a promising solution for advanced semiconductor manufacturing.

Robust Domain Generalization for Multi-modal Object Recognition

In multi-label classification, machine learning encounters the challenge of domain generalization when handling tasks with distributions differing from the training data. Existing approaches primarily focus on vision object recognition and neglect the integration of natural language. Recent advancements in vision-language pre-training leverage supervision from extensive visual-language pairs, enabling learning across diverse domains and enhancing recognition in multi-modal scenarios. However, these approaches face limitations in loss function utilization, generality across backbones, and class-aware visual fusion. This paper proposes solutions to these limitations by inferring the actual loss, broadening evaluations to larger vision-language backbones, and introducing Mixup-CLIPood, which incorporates a novel mix-up loss for enhanced class-aware visual fusion. Our method demonstrates superior performance in domain generalization across multiple datasets.

PIC2O-Sim: A Physics-Inspired Causality-Aware Dynamic Convolutional Neural Operator for Ultra-Fast Photonic Device FDTD Simulation

The finite-difference time-domain (FDTD) method, which is important in photonic hardware design flow, is widely adopted to solve time-domain Maxwell equations. However, FDTD is known for its prohibitive runtime cost, taking minutes to hours to simulate a single device. Recently, AI has been applied to realize orders-of-magnitude speedup in partial differential equation (PDE) solving. However, AI-based FDTD solvers for photonic devices have not been clearly formulated. Directly applying off-the-shelf models to predict the optical field dynamics shows unsatisfying fidelity and efficiency since the model primitives are agnostic to the unique physical properties of Maxwell equations and lack algorithmic customization. In this work, we thoroughly investigate the synergy between neural operator designs and the physical property of Maxwell equations and introduce a physics-inspired AI-based FDTD prediction framework PIC2O-Sim which features a causality-aware dynamic convolutional neural operator as its backbone model that honors the space-time causality constraints via careful receptive field configuration and explicitly captures the permittivity-dependent light propagation behavior via an efficient dynamic convolution operator. Meanwhile, we explore the trade-offs among prediction scalability, fidelity, and efficiency via a multi-stage partitioned time-bundling technique in autoregressive prediction. Multiple key techniques have been introduced to mitigate iterative error accumulation while maintaining efficiency advantages during autoregressive field prediction. Extensive evaluations on three challenging photonic device simulation tasks have shown the superiority of our PIC2O-Sim method, showing 51.2% lower roll-out prediction error, 23.5 times fewer parameters than state-of-the-art neural operators, providing 300-600x higher simulation speed than an open-source FDTD numerical solver.

ILILT: Implicit Learning of Inverse Lithography Technologies

Lithography, transferring chip design masks to the silicon wafer, is the most important phase in modern semiconductor manufacturing flow. Due to the limitations of lithography systems, Extensive design optimizations are required to tackle the design and silicon mismatch. Inverse lithography technology (ILT) is one of the promising solutions to perform pre-fabrication optimization, termed mask optimization. Because of mask optimization problems' constrained non-convexity, numerical ILT solvers rely heavily on good initialization to avoid getting stuck on sub-optimal solutions. Machine learning (ML) techniques are hence proposed to generate mask initialization for ILT solvers with one-shot inference, targeting faster and better convergence during ILT. This paper addresses the question of \textit{whether ML models can directly generate high-quality optimized masks without engaging ILT solvers in the loop}. We propose an implicit learning ILT framework: ILILT, which leverages the implicit layer learning method and lithography-conditioned inputs to ground the model. Trained to understand the ILT optimization procedure, ILILT can outperform the state-of-the-art machine learning solutions, significantly improving efficiency and quality.

CAMO: Correlation-Aware Mask Optimization with Modulated Reinforcement Learning

Optical proximity correction (OPC) is a vital step to ensure printability in modern VLSI manufacturing. Various OPC approaches based on machine learning have been proposed to pursue performance and efficiency, which are typically data-driven and hardly involve any particular considerations of the OPC problem, leading to potential performance or efficiency bottlenecks. In this paper, we propose CAMO, a reinforcement learning-based OPC system that specifically integrates important principles of the OPC problem. CAMO explicitly involves the spatial correlation among the movements of neighboring segments and an OPC-inspired modulation for movement action selection. Experiments are conducted on both via layer patterns and metal layer patterns. The results demonstrate that CAMO outperforms state-of-the-art OPC engines from both academia and industry.

Optimizing Predictive AI in Physical Design Flows with Mini Pixel Batch Gradient Descent

Exploding predictive AI has enabled fast yet effective evaluation and decision-making in modern chip physical design flows. State-of-the-art frameworks typically include the objective of minimizing the mean square error (MSE) between the prediction and the ground truth. We argue the averaging effect of MSE induces limitations in both model training and deployment, and good MSE behavior does not guarantee the capability of these models to assist physical design flows which are likely sabotaged due to a small portion of prediction error. To address this, we propose mini-pixel batch gradient descent (MPGD), a plug-and-play optimization algorithm that takes the most informative entries into consideration, offering probably faster and better convergence. Experiments on representative benchmark suits show the significant benefits of MPGD on various physical design prediction tasks using CNN or Graph-based models.