Towards 3D Acceleration for low-power Mixture-of-Experts and Multi-Head Attention Spiking Transformers

Spiking Neural Networks(SNNs) provide a brain-inspired and event-driven mechanism that is believed to be critical to unlock energy-efficient deep learning. The mixture-of-experts approach mirrors the parallel distributed processing of nervous systems, introducing conditional computation policies and expanding model capacity without scaling up the number of computational operations. Additionally, spiking mixture-of-experts self-attention mechanisms enhance representation capacity, effectively capturing diverse patterns of entities and dependencies between visual or linguistic tokens. However, there is currently a lack of hardware support for highly parallel distributed processing needed by spiking transformers, which embody a brain-inspired computation. This paper introduces the first 3D hardware architecture and design methodology for Mixture-of-Experts and Multi-Head Attention spiking transformers. By leveraging 3D integration with memory-on-logic and logic-on-logic stacking, we explore such brain-inspired accelerators with spatially stackable circuitry, demonstrating significant optimization of energy efficiency and latency compared to conventional 2D CMOS integration.

Spiking Transformer Hardware Accelerators in 3D Integration

Spiking neural networks (SNNs) are powerful models of spatiotemporal computation and are well suited for deployment on resource-constrained edge devices and neuromorphic hardware due to their low power consumption. Leveraging attention mechanisms similar to those found in their artificial neural network counterparts, recently emerged spiking transformers have showcased promising performance and efficiency by capitalizing on the binary nature of spiking operations. Recognizing the current lack of dedicated hardware support for spiking transformers, this paper presents the first work on 3D spiking transformer hardware architecture and design methodology. We present an architecture and physical design co-optimization approach tailored specifically for spiking transformers. Through memory-on-logic and logic-on-logic stacking enabled by 3D integration, we demonstrate significant energy and delay improvements compared to conventional 2D CMOS integration.